Bambu Lab
Bambu PC - Filament with Spool
Bambu PC - Filament with Spool
PLX-17-0073-0001Regular price
282,00 lei
Regular price
310,00 lei
Sale price
282,00 lei
Unit price
per
Tax included.
⚠️ This product is available on backorder. Estimated delivery time is 5 business days after payment confirmation.
📦 Final shipping cost may increase if your cart contains products from multiple vendors (e.g., 2 vendors = 2 shipping charges).
📦 Final shipping cost may increase if your cart contains products from multiple vendors (e.g., 2 vendors = 2 shipping charges).
SKU: PLX-17-0073-0001
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Accessory Compatibility
| Recommended | Not Recommended | |
| Build Plate | Smooth PEI Plate, Textured PEI Plate | Cool Plate SuperTack |
| Hotend | All Size / Material | / |
| Glue | Glue Stick | Bambu Liquid Glue |
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).
Load and print! No more tedious setting steps.
| Recommended Printing Settings | |
| Drying Settings (Blast Drying Oven) | 80 °C，8h |
| Printing and Keeping Container's Humidity | < 20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 250 - 270 °C |
| Bed Temperature (with Glue) | 90 - 110 °C |
| Printing Speed | < 300 mm/s |
| Physical Properties | |
| Density | 1.20 g/cm³ |
| Vicat Softening Temperature | 119 °C |
| Heat Deflection Temperature | 117 °C |
| Melting Temperature | 228 °C |
| Melt Index | 32.2 ± 2.9 g/10 min |
| Mechanical Properties | |
| Tensile Strength | 55 ± 4 MPa |
| Breaking Elongation Rate | 3.8 ± 0.3 % |
| Bending Modulus | 2310 ± 70 MPa |
| Bending Strength | 108 ± 4 MPa |
| Impact Strength | 34.8 ± 2.1 kJ/m² |
